Method and apparatus for removing coating from substrate

B - Operations – Transporting – 23 – K

Patent

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204/109, 204/96

B23K 10/00 (2006.01)

Patent

CA 1312305

METHOD AND APPARATUS FOR REMOVING COATING FROM SUBSTRATE Abstract of the Disclosure In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, ultraviolet radiation generated as a byproduct of plasma generation is absorbed by a baffle placed between a plasma source and the substrate. The baffle inhibits incidence of ultraviolet light on the substrate while permitting flow of activated gas onto the substrate to chemically strip the photoresist from the substrate. Use of the baffle reduces microscopic damage to the substrate. - i -

548901

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