Method and apparatus for removing heat from a component

Details Method and apparatus for removing heat from a component Method and apparatus for removing heat from a component

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/367 (2006.01) H01L 23/427 (2006.01)

Patent

CA 2399898

An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

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