B - Operations – Transporting – 27 – D
Patent
B - Operations, Transporting
27
D
B27D 1/10 (2006.01) B26D 3/02 (2006.01) B27B 5/04 (2006.01) B27B 5/08 (2006.01) B27B 25/00 (2006.01) B27G 19/10 (2006.01)
Patent
CA 2275013
When scarfing the end portion of a plate-like material with irregular deformations or undulations, such as distortions, undulations and warps, the undulations are successively corrected flat and the flattened end portion is scarfed by a rotary cutter to form a highly precise scarfed surface. When the end portion of the plate-like material 3 is scarfed by the rotary cutter 5, the pressing member 11 presses, while the cutting operation proceeds, at least a part of the surface of at least that portion of the plate-like material 3 which is to be cut away as a chip 17 at a position near the blades 5b of the rotary cutter on a downstream side of the rotary cutter with respect to a rotary cutter movement direction, the surface of the plate-like material 3 pressed by the pressing member 11 being opposite the other surface held in contact with the cutter receiving table 7.
Otsuka Toshiyuki
Yamamoto Kiichi
Meinan Machinery Works Inc.
Robic
LandOfFree
Method and apparatus for scarfing a plate-like material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for scarfing a plate-like material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for scarfing a plate-like material will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1796491