Method and apparatus for sealing flex circuits having heat...

B - Operations – Transporting – 29 – C

Patent

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B29C 65/00 (2006.01)

Patent

CA 2596440

A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

L'invention concerne un procédé et un appareil permettant d'appliquer une couche de revêtement constituée d'un polymère à cristaux liquides sur un circuit imprimé souple comprenant des éléments circuit montés sur un substrat polymère à cristaux liquides pour encapsuler les éléments circuit entre la couche de revêtement et le substrat afin de les protéger de toute exposition à l'humidité et aux contaminants, et d'apporter une protection thermique aux éléments circuit thermosensibles du circuit imprimé souple pendant le procédé d'encapsulage.

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