Method and apparatus for selective electroplating using...

Details Method and apparatus for selective electroplating using... Method and apparatus for selective electroplating using...

C - Chemistry, Metallurgy

25

D

C25D 17/00 (2006.01) C25D 5/06 (2006.01)

Patent

CA 2136918

A device is provided for brush electroplating a surface of a workpiece. The device includes an anode generally composed of a metal to be electroplated on the surface of the workpiece. The anode is selectively retained within a cavity formed in a lower surface of a carrier piece composed of a generally electrical non-conductive material. The lower surface of the carrier piece is shaped to conform to at least a portion of the surface of the workpiece. An absorbent material extends over the lower surface of the carrier piece to form a brush. The cover material and lower surface of the anode are spaced from each other to form a chamber. The device also includes an assembly, fluidly connected to the space between the anode and absorbent material, to inject a flow of the electrolytic fluid into the chamber.

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