Method and apparatus for sequential plasma treatment

Details Method and apparatus for sequential plasma treatment Method and apparatus for sequential plasma treatment

C - Chemistry, Metallurgy

23

C

C23C 16/509 (2006.01) C23C 16/04 (2006.01) H01J 37/32 (2006.01)

Patent

CA 2444766

The apparatus for plasma treatment of a non-conductive hollow substrate (1), comprises a plurality of ionisation energy sources (7-10) disposed adjacent to each other all along the part of the substrate to be treated. The apparatus further comprises a processing means (11) for sequentially powering the plurality of ionisation energy sources from a radio frequency power source (6). Each ionisation energy source (7) is comprised of two parts (7a, 7b) sandwiching the substrate. The ionisation energy sources can be capacitively or inductively coupled plasma sources.

L'invention concerne un appareil conçu pour le traitement au plasma d'un substrat (1) creux non conducteur, qui comprend plusieurs sources d'énergie ionisante (7-10) contiguës tout le long de la partie du substrat à traiter. L'appareil comprend en outre un dispositif (11) de traitement destiné à exciter séquentiellement les sources d'énergie ionisante à partir d'une source de puissance haute fréquence (6). Chaque source d'énergie ionisante (7) comporte deux parties (7a, 7b) prenant le substrat en sandwich. Les sources d'énergie ionisante peuvent être des sources au plasma à couplage capacitif ou inductif.

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