Method and apparatus for simultaneously bonding a plurality...

Details Method and apparatus for simultaneously bonding a plurality... Method and apparatus for simultaneously bonding a plurality...

H - Electricity

05

K

356/146, 356/193

H05K 3/32 (2006.01) B23K 20/02 (2006.01) H01L 21/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1043472

Abstract of the Disclosure Method and apparatus are disclosed for concurrently thermocompression bonding a plurality of lead frames to a plurality of planar articles. In operation, a plurality of lead frames are referenced to a plurality of unheated bonding tips and to the associated metallized bonding sites on a first side of a plurality of planar articles. The bonding tips are then simultaneously activated to independently move the referenced lead frames and article in a first direction to engage the second side of each article with a heated thermode, and apply a sufficient compressive force to bond the leads of each lead frame to the associated bonding sites on the referenced article. The bonding tips are then returned to their initial or starting position.

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