Method and apparatus for soldering aluminum

Details Method and apparatus for soldering aluminum Method and apparatus for soldering aluminum

C - Chemistry, Metallurgy

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C25D 5/06 (2006.01) B23K 1/19 (2006.01) B23K 1/20 (2006.01) B23K 35/00 (2006.01) C25D 5/44 (2006.01) C25D 5/50 (2006.01) C25F 7/00 (2006.01)

Patent

CA 1153727

ABSTRACT OF THE DISCLOSURE A method and apparatus for soldering aluminum are disclosed. According to the method, the aluminum surface to be soldered is subject to conventional cleaning, then elec- trolytic cleaning and electlolytic etching, followed by elec- troplating a very thin layer of nickel on the cleaned and etched surface. The electrolytic cleaning, etching, and plating operations are all carried out by the use of a brush plating tool having an insulated handle portion, to one end of which a wire electrode encased in a porous covering com- posed of polyester felt is secured. After the plating has been completed, the surface may be soldered with conventional soft solders and non-cor- rosive fluxes, using conventional soldering techniques.

351729

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