G - Physics – 01 – B
Patent
G - Physics
01
B
G01B 11/06 (2006.01)
Patent
CA 2086848
ABSTRACT Improved interferometric methods for mapping the variations in the thickness of a thin dielectric film or layer at a large number of sites are described. A scanning optical measurement apparatus is used to obtain the measurements required for the methods of invention. Infrared light is applied to a thin layer, and the interference fringes due to a single wavelength of light are sampled to provide a map of the monochromatic reflectance of the thin layer. The monochromatic reflectance map is analyzed, and a small number of sites are selected according to the methods of the invention for absolute thickness determination by known methods. The interference order is determined for each one of the small number of sites from the determined absolute thickness values. The interference order and monochromatic reflectance are then used to calculate the thickness of the thin layer at other sites. This process allows large numbers of thickness determina- tions to be made quickly. Real data, containing noise and dis- tortions, can be processed by the methods of the invention.
Cole John H.
Miner Carla J.
Moore Christopher J.
Cole John H.
Miner Carla J.
Moore Christopher J.
Schnurr Daryl W.
LandOfFree
Method and apparatus for spatially resolved thickness mapping does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for spatially resolved thickness mapping, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for spatially resolved thickness mapping will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1720722