Method and apparatus for the real-time, non-destructive...

Details Method and apparatus for the real-time, non-destructive... Method and apparatus for the real-time, non-destructive...

G - Physics

01

N

73/164, 349/44

G01N 29/00 (2006.01) G01N 19/04 (2006.01) G01N 29/14 (2006.01) G01N 29/22 (2006.01) G01N 29/32 (2006.01)

Patent

CA 1047156

Abstract of the Disclosure The strength of an adhesion bond can be determined using stress-wave emission techniques. One method measures the stress-wave energy emitted from the bonding area during the compression phase of the formation of the bond and compares this measurement with a predetermined substantially linear relationship between the emitted stress-wave energy and the strength of the adhesion bond. For more accuracy, a second method measures the stress-wave energy during both the compression phase and a pressure-relief interval, determines the difference between the two measurements, and compares the difference value with the substantially linear relationship. An alternative to the second method substracts a predetermined threshold value from the pressure-relief interval measurement, reduces the compression phase measurement by the excess determined by said substraction step, and compares the reduced compression phase measurement with the predetermined substantially linear relationship to determine the strength of the bond.

257595

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