Method and apparatus for thermal conductivity measurements

G - Physics – 01 – N

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G01N 25/18 (2006.01) G01N 25/20 (2006.01) G01N 25/48 (2006.01)

Patent

CA 2125537

The present invention is a method and apparatus for measuring the thermal conductivity of materials using modulated differential scanning calorimetry (MDSC). Two MDSC heat capacity measurements are made consecutively. One measurement is made under conditions which ensure obtaining a fairly accurate value for the heat capacity of the material. Another measurement is made under conditions such that the measured effective heat capacity differs from the accurate value of the heat capacity due to thermal conductivity effects. The thermal conductivity of the material is then calculated. For example, a large sample and a small sample of the material whose thermal conductivity is to be determined are prepared with different sample geometries. The specific heat of the small sample and the effective heat capacity of the large sample are the measured using MDSC. The thermal conductivity of the material is then calculated from these measured values, using equations derived from the one-dimensional thermal diffusivity equation. In one embodiment of the invention, increased accuracy is achieved by measuring the thermal conductivity of a sample of a material having a known thermal conductivity, and then calculating a correction factor that can be applied to all samples having similar dimensions. In another embodiment of the invention, the thermal conductivity of a thin film is measured by placing a thin film on the sample position and using MDSC to measure the effective heat capacity of a cylinder placed on top of the thin film. The thermal conductivity of the sample is then calculated from the measured effective heat capacity of the cylinder, the known true heat capacity of the cylinder, and the dimensions of the cylinder.

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