Method and apparatus for transferring solder bumps

Details Method and apparatus for transferring solder bumps Method and apparatus for transferring solder bumps

H - Electricity

05

K

H05K 3/22 (2006.01) B23K 1/00 (2006.01) B23K 3/06 (2006.01) H01L 21/60 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2426651

The subject matter relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit devices on substrates. A mold having cavities for the solder bumps is held in contact with a substrate and initially comprises a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.

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