C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
C23G 5/00 (2006.01) B23K 1/20 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2293610
The invention concerns a dry process surface treatment method for treating at least a metal surface portion, wherein the portion is treated at a pressure close to atmospheric pressure with a treating gas stream comprising excited and unstable species, which consists in locally increasing the treating gas pressure on the metal surface portion so as to force the l species to move along a direction substantially perpendicular to the surface. The invention is useful for wave brazing electronic components on printed circuit wafers.
Dans ce procédé de traitement de surface par voie sèche d'au moins une portion de surface métallique, selon lequel la portion est traitée à une pression voisine de la pression atmosphérique par un flux de gaz de traitement comprenant des espèces excitées ou instables, on augmente localement la pression du gaz de traitement sur la portion de surface métallique de manière à forcer les espèces chimiques à se déplacer selon une direction sensiblement perpendiculaire à la surface. Application au brasage à la vague de composants électroniques sur plaquettes de circuits imprimés.
Rabia Stephane
Sindzingre Thierry
Verbockhaven Denis
L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Proced Es Geo
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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