Method and apparatus for ultrasonic bonding

Details Method and apparatus for ultrasonic bonding Method and apparatus for ultrasonic bonding

B - Operations, Transporting

23

K

26/106

B23K 20/10 (2006.01)

Patent

CA 1181933

METHOD AND APPARATUS FOR ULTRASONIC BONDING Abstract A method and apparatus for providing high reliability ultrasonic bonds by monitoring the force required to separate the bonding tool from the wire after the bonding operation. This force which is required to break an incidental bond between the tool and the wire is related to the quality of the primary bond of the wire to a conductor terminal. The output of a transducer is proportional to the force and it may be coupled to a visual display, alarm, or computer for trend analysis.

410727

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