C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
32/24, 117/92
C23C 14/56 (2006.01) C21D 9/56 (2006.01)
Patent
CA 1239060
ABSTRACT OF THE DISCLOSURE For vacuum deposition plating steel strip, a vacuum deposition plating apparatus is used including an inlet-side vacuum sealing device provided in front of a vacuum deposition plating chamber, with an inlet-side inactive gas replacement chamber provided between the inlet-side vacuum sealing device and an annealing furnace. An outlet-side vacuum sealing device is provided at the rear of the vacuum deposition plating chamber, with an outlet-side inactive gas replacement chamber provided between the outlet-side vacuum sealing device and the atmosphere. An inactive gas circulating/purifying device circulates an in- active gas from vacuum chambers of both the vacuum sealing devices to atmospheric pressure chambers of both the vacuum sealing devices and removes water, oil and oxygen from the inactive gas. Oxygen and hydrogen in the inactive gas are regulated to provide 60 ppm or less of oxygen end 0.2 to 2.0% of hydrogen, and also to regulate the dew point of the inactive gas to -50°C or less. Further, a pressure P1 in the annealing furnace, a pressure P2 in - 1 - the inlet-side inactive gas replacement changer, and a pressure P3 in the outlet-side inactive gas replacement chamber are maintained at atmospheric pressure or more. A value of P1 - P2 can be kept at 0 mmAq or more, and the concentration of hydrogen in the inlet- side inactive gas replacement chamber is held to 2.0° or less. - 2 -
490764
Aiko Takuya
Furukawa Heizaburo
Katoh Mitsuo
Kittaka Toshiharu
Nakanishi Yasuji
Fetherstonhaugh & Co.
Mitsubishi Jukogyo Kabushiki Kaisha
Nisshin Steel Co. Ltd.
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