B - Operations – Transporting – 23 – P
Patent
B - Operations, Transporting
23
P
B23P 15/00 (2006.01) B23P 15/26 (2006.01) H01L 21/48 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2126873
A first heat sink member (101) with extension slots (103) and component detailing is cast from a thermally conductive material. Fin members (102) are constructed from a similar, but not necessarily identical, thermally conductive material. The fin members (102) are constructed so that they will mate with the extension slots (103) of the first heat sink member. Positioned in alignment with the extension slots (103) to the first heat sink member, the fin members (102) are attached with a thermally conductive bonding agent.
Un premier élément (101) de dissipateur de chaleur pourvu de fentes de prolongement (103) et d'organes constitutifs est moulé dans un matériau thermoconducteur. Des ailettes (102) sont réalisées à partir d'un matériau thermoconducteur similaire, mais pas nécessairement identique. Les ailettes (102) sont structurées de telle sorte qu'elles s'adaptent dans les fentes de prolongement (103) du premier élément du dissipateur de chaleur. Placées en alignement avec les fentes de prolongement (103) du premier élément du dissipateur de chaleur, les ailettes (102) sont fixées à l'aide d'un agent de fixation thermoconducteur.
Lubbe John N.
Olivera Raul
Onyszko Lester J.
Gowling Lafleur Henderson Llp
Motorola Inc.
LandOfFree
Method and apparatus of an improved heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus of an improved heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus of an improved heat sink will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2078218