Method and apparatus of forming thick film circuits

Details Method and apparatus of forming thick film circuits Method and apparatus of forming thick film circuits

H - Electricity

01

L

356/22, 356/6

H01L 49/02 (2006.01) H01L 21/70 (2006.01) H05K 3/12 (2006.01)

Patent

CA 1231464

ABSTRACT Disclosed is a method and apparatus for forming pat- terns in a thick film circuit or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The pattern forming apparatus comprises a writing head for storing paste to form patterns, and the writing head lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and, while in the same state, moves laterally to another arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, blurring or blotting at the begin- ning and ending part of the pattern writing may be prevent- ed, so that patterns may be formed at high speed and with high precision.

461027

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