Method and apparatus of manufacturing hybrid integrated circuit

Details Method and apparatus of manufacturing hybrid integrated circuit Method and apparatus of manufacturing hybrid integrated circuit

H - Electricity

01

L

356/193

H01L 21/68 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1137651

ABSTRACT OF THE DISCLOSURE A method of manufacturing a hybrid integrated circuit comprises the steps of: a) placing chip-type circuit elements on predetermined portions of a template; b) preparing a printed circuit board having adhesive material at given portions thereof; c) piling the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material; d) turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board; e) hardening the adhesive material to temporarily hold the circuit elements on the circuit board; and f) soldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns. This method of the present invention is well performed with an element-distributing apparatus which will be below ex- plained in details.

348985

Affiliated with

Also associated with

Rating

Method and apparatus of manufacturing hybrid integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus of manufacturing hybrid integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus of manufacturing hybrid integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-403280