Method and apparatus to change solder pad size using a...

Details Method and apparatus to change solder pad size using a... Method and apparatus to change solder pad size using a...

H - Electricity

05

K

H05K 3/40 (2006.01) H01R 33/94 (2006.01)

Patent

CA 2632306

A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above the polyimide layer to define caps, removing portions of the copper layer to form conductive pads, and filling gaps between the conductive pads with an insulator, wherein individual conductive pads are in electrical contact with corresponding individual caps.

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