Method and apparatus to contact plating bar without exposing...

Details Method and apparatus to contact plating bar without exposing... Method and apparatus to contact plating bar without exposing...

H - Electricity

05

B

H05B 1/02 (2006.01) H05B 3/00 (2006.01) H05B 3/22 (2006.01) H05K 1/11 (2006.01) H05K 3/24 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2162941

A printed wiring board includes a contact pad and a plating bar positioned in spaced apart relation on the surface of the wiring board. An electrically conductive track internal to the printed wiring board has a first end positioned at about the plating bar and a second end positioned at about the contact pad. A first electrically conductive via extends between the plating bar and the first end of the internal track and electrically connects the plating bar and the internal track. A second electrically conductive via extends between the contact pad and the second end of the internal track and electrically connects the internal track to the contact pad.

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