Method and bath for the electroless plating of gold

Details Method and bath for the electroless plating of gold Method and bath for the electroless plating of gold

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/44 (2006.01)

Patent

CA 1182953

TITLE METHOD AND BATH FOR THE ELECTROLESS PLATING OF GOLD ABSTRACT The present invention relates to a method and bath for the electroless plating of gold using an aqueous solution of trivalent gold, a ligand and a tertiary or secondary amine borane reducing agent. Preferably, a stabilizer such as 6-ethoxy-2-mercaptobenzothiozole is used in the bath.

418444

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