Method and composition for electroplating

Details Method and composition for electroplating Method and composition for electroplating

C - Chemistry, Metallurgy

25

D

204/12

C25D 5/34 (2006.01) C25D 5/06 (2006.01) C25D 17/14 (2006.01)

Patent

CA 1066220

ABSTRACT An improved method and composition for plating a workpiece with tin, cadmium, lead, or indium which involves first applying an aqueous electrolyte to the substrate with a rubbing action and without electroplating voltage being applied and then applying the electroplating voltage to an anode com- posed of one of the aforementioned metals, utilizing the same aqueous electrolyte to plate metal from the anode onto the substrate, The aqueous electrolyte contains dissolved free sulfamic acid in concentrations up to saturation, and the electrolyte is substantially devoid of ions of a plateable metal. The electrolyte preferably includes a small amount of a surface active wetting agent.

273617

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