C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/20, 204/24.5
C25D 11/20 (2006.01) C25D 5/44 (2006.01) C25D 11/06 (2006.01) C25D 11/10 (2006.01)
Patent
CA 1043287
METHOD AND COMPOSITION FOR ELECTROPLATING ALUMINUM ALLOYS ABSTRACT A method of and a bath composition for conditioning the surface of an aluminium alloy article to substantially increase the adhesion to the conditioned surface of subsequently applied electrodeposited surface layer. More specifically the surface of the article is anodized in a solution having three components, i.e. phosphoric acid, sulfuric acid and an organic acid selected from the group consisting of acetic acid, hydroxy acetic acid and amino acetic acid. The anodizing operation typically is followed by a nickel strike deposit, and this deposit may be subsequently electroplated under conventional operating conditions.
223195
Clauss Richard J.
Tremmel Robert A.
Wieczerniak Walter J.
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