Method and composition for plating palladium

Details Method and composition for plating palladium Method and composition for plating palladium

C - Chemistry, Metallurgy

25

D

204/29.5

C25D 3/50 (2006.01)

Patent

CA 1062650

METHOD AND COMPOSITION FOR PLATING PALLADIUM ABSTRACT OF THE DISCLOSURE This invention relates to the palladium plating of electrical contacts and more particularly to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.

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