Method and composition for treating plastic substrates prior...

B - Operations – Transporting – 05 – D

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B05D 5/00 (2006.01) B05D 3/10 (2006.01) C23C 18/20 (2006.01)

Patent

CA 1062998

ABSTRACT OF THE DISCLOSURE The present invention is directed to a process and composition for accelerating the activation of a polymeric surface prior to electroless plating thereof, wherein there is employed a solution comprising a relatively dilute inorganic acid, a metal salt selected from Group VIII B of the Periodic Chart but excluding iron, and a compound capable or ionizing to produce a source of fluoride ions, By so proceeding, microscopic cavities in the polymeric substrate are thoroughly cleansed of residual tin ions which remain subsequent to rins- ing of the polymeric body following the conventional activation step employing an acidic solution of palladium chloride and stann- ous chloride. The removal of palladium ions, which have a catal- ytic effect in the electroless plating operation, is minimized by the composition and process of this invention, and further, in addition to other advantages, there is achieved relatively low and uniform values of part resistance and contact resistance.

201046

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