Method and device for analyzing a layer of a metal working...

Details Method and device for analyzing a layer of a metal working... Method and device for analyzing a layer of a metal working...

G - Physics

01

N

G01N 21/35 (2006.01) B21B 45/02 (2006.01) G01N 21/64 (2006.01)

Patent

CA 2656068

The invention relates to a method for analyzing a layer of a metal working compound (50) on the surface of a product to be shaped (40), especially of a metal strip, before and/or after a shaping process, especially a rolling process, for various measuring variables. According to the invention, analysis of the metal working compound (50) is carried out by way of spectroscopic analysis. The invention also relates to a method for carrying out the method according to the invention.

L'invention concerne un procédé permettant d'analyser une couche d'agent auxiliaire (50) sur la surface d'un produit de déformation plastique (40), notamment une bande métallique, avant et/ou après un processus de déformation, notamment un processus de laminage, en termes de différentes variables à mesurer. A cet effet, il est prévu que l'analyse de l'agent auxiliaire (50) s'effectue par analyse spectrale. L'invention concerne en outre un dispositif pour mettre ledit procédé en oeuvre.

Affiliated with

Also associated with

Rating

Method and device for analyzing a layer of a metal working... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and device for analyzing a layer of a metal working..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for analyzing a layer of a metal working... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1594297