Method and device for changing a semiconductor wafer position

Details Method and device for changing a semiconductor wafer position Method and device for changing a semiconductor wafer position

H - Electricity

01

L

H01L 21/00 (2006.01) H01L 21/68 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2331079

The invention concerns a device for positioning a semiconductor wafer (2) provided with a positioning mark (3) and placed in a support designed to house a plurality of semiconductor wafers, said device comprising an arm for grasping the wafer, means for moving the arm, the latter including: means for grasping the semiconductor wafer peripheral portion; means for directing the wafer co-operating with the grasping means so as to place the positioning mark in a predetermined position. The means for moving (120) the prehensile arm (1) comprise means for displacement along three spatial directions (X, Y, Z), the grasping means (5) and the directing means (6) being arranged on a rigid structure (7), the grasping means being distributed over the semiconductor wafer peripheral portion perimeter.

Dispositif permettant un changement de position d'une plaque de semi-conducteur (2) munie d'un repère de positionnement (3) et placée dans un support destiné à loger une pluralité de plaques de semi-conducteur, le dispositif comprenant un bras de préhension de la plaque, des moyens de déplacement du bras, ce dernier comprenant: des moyens de prise par la partie périphérique de la plaque de semi-conducteur; des moyens d'orientation de la plaque coopérant avec les moyens de prise afin de placer le repère de positionnement dans une position déterminée; les moyens de déplacement (120) du bras de préhension (1) comprenant des moyens de déplacement suivant trois directions (X, Y, Z) de l'espace, les moyens de prise (5) et les moyens d'orientation (6) étant disposés sur une structure rigide (7), les moyens de prise étant répartis sur le périmètre de la partie périphérique de la plaque de semi-conducteur.

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