H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/00 (2006.01)
Patent
CA 2481260
The present invention provides a method for conditioning semiconductor wafers and/or hybrids having the steps: preparation of a space (1) which is at least partially enclosed and has a wafer/hybrid holding device (10) which is located therein and has the purpose of holding a semiconductor wafer and/or hybrid; and conduction of a dry fluid through the wafer/hybrid holding device (10) in order to heat-treat the wafer/hybrid holding device (10); wherein at least a portion of the fluid leaving the wafer/hybrid holding device (10) is used to condition the atmosphere within the space (1). The invention also provides a corresponding device for conditioning semiconductor wafers and/or hybrids.
L'invention concerne un procédé pour conditionner des plaquettes semi-conductrices et/ou des hybrides selon les opérations suivantes : préparer un espace (1) au moins partiellement fermé dans lequel se trouve un dispositif (10) destiné à recevoir une plaquette semi-conductrice et/ou un hybride; faire passer un fluide sec à travers le dispositif (10) de réception de plaquette/d'hybride pour tempérer ce dernier (10). Selon l'invention, au moins une partie du fluide sortant du dispositif (10) est utilisé pour conditionner l'atmosphère à l'intérieur de l'espace (1). La présente invention porte également sur un dispositif correspondant pour conditionner des plaquettes semi-conductrices et/ou des hybrides.
Ers Electronic Gmbh
Oyen Wiggs Green & Mutala Llp
LandOfFree
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