C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/08 (2006.01) C23C 2/14 (2006.01) C23C 2/24 (2006.01) C25D 17/10 (2006.01) C25D 17/16 (2006.01) H05K 3/24 (2006.01) H05K 1/00 (2006.01)
Patent
CA 2496957
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of - immersing the substrate with the pattern present thereon in an electrolytic bath, - electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and - effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
Loermans Peter Jacobus Gerardus
Van de Ven Augustinus Cornelis Maria
Besi Plating B.v.
Meco Equipment Engineers B. V.
Sim & Mcburney
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