Method and device for isolating plate-like substrates

B - Operations – Transporting – 28 – D

Patent

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B28D 5/00 (2006.01)

Patent

CA 2388730

The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.

L'invention concerne un procédé pour séparer et détacher des substrats minces et fragiles (11), en forme de tranche, qui ont été découpés dans un bloc de substrat (13) maintenu bloqué sur une plaque de base (12), de préférence au moyen d'un collage. Selon ce procédé, le substrat en forme de tranche est saisi en des points, distants les uns des autres, de sa surface extérieure (16) en forme de tranche, et soumis à un mouvement oscillant de sorte que chaque substrat en forme de tranche (11) du bloc de substrat scié puisse être détaché du joint de collage (15), de manière automatique et sans dégradation.

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