Method and device for microwave plasma deposition of a...

H - Electricity – 05 – H

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H05H 1/46 (2006.01) B65D 23/02 (2006.01) C23C 16/04 (2006.01) C23C 16/511 (2006.01) H01J 37/32 (2006.01) H05H 1/24 (2006.01)

Patent

CA 2507319

The invention concerns the deposition of a coating on a thermoplastic container surface (3) using low pressure plasma by excitation of a precursor gas with UHF electromagnetic waves in a circular shaped vacuum cavity (1) receiving the container. It consists in dimensioning the cavity (1) with respect to the frequency of the UHF electromagnetic waves so as to obtain a coupling mode generating several electromagnetic fields inside the cavity. In particular a TM 120 coupling mode is provided which generates two central fields (4¿A?, 4¿B?) inside the cavity, whereby two containers (3) can be simultaneously treated in said cavity (1).

L'invention concerne le dépôt d'un revêtement sur une face d'un récipient (3) en matériau thermoplastique à l'aide d'un plasma à basse pression par excitation d'un gaz précurseur par des ondes électromagnétiques UHF dans une cavité (1) sous vide de forme circulaire recevant le récipient. On dimensionne la cavité (1) en relation avec la fréquence des ondes électromagnétiques UHF de manière à obtenir un mode de couplage générant plusieurs champs électromagnétiques à l'intérieur de la cavité. Notamment, on établit un mode de couplage TM 120 qui génère deux champs centraux (4A, 4B) à l'intérieur de la cavité, ce grâce à quoi on peut traiter simultanément deux récipients (3) dans ladite cavité (1).

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