B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 26/12 (2006.01) B23K 26/14 (2006.01)
Patent
CA 2711664
The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.
L'invention concerne un procédé de traitement d'un substrat mobile au moyen d'un laser, le traitement provoquant la libération de matière séparée du substrat, une pression plus élevée régnant, au cours du traitement du substrat, du côté du substrat où celui-ci est frappé par le faisceau laser que de l'autre côté du substrat. L'invention concerne également un dispositif destiné à réaliser un tel traitement et comprenant un moyen de guidage servant à guider le substrat et un moyen de traitement laser conçu pour projeter sur le substrat une tache laser qui traite le substrat dans une zone de traitement au laser, et comprenant un moyen de générer une pression plus élevée du côté du substrat où celui-ci est frappé par le faisceau laser que de l'autre côté du substrat.
Iai Industrial Systems B.v.
Industrial Automation Integrators (iai) B.v.
Smart & Biggar
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