Method and device for producing a soldered joint

B - Operations – Transporting – 23 – K

Patent

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B23K 1/008 (2006.01)

Patent

CA 2390498

A method and device for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier, wherein the at least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment, whereby in a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment, and whereby the component is heated and cooled in process chambers (12, 13) which are independent of each other.

L'invention concerne un procédé et un dispositif de traitement thermique de pièces ou composants, notamment de production d'un joint soudé entre une matière de brasage et au moins un composant ou une pièce servant de support à la matière de brasage par fusion de la matière de brasage sur le support. Au moins un composant est chauffé dans une chambre de fusion (12) dans une atmosphère de traitement isolée de l'environnement. Ensuite, ce composant est refroidi dans une chambre de refroidissement (13) dans une atmosphère de traitement isolée de l'environnement. Le chauffage et le refroidissement du composant sont effectués dans les chambres (12, 13) qui sont indépendantes l'une de l'autre.

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