Method and device for testing of electronic components

G - Physics – 01 – R

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G01R 31/02 (2006.01)

Patent

CA 2205391

A test assembly for use in testing electronic components, preferably surface mount IC-circuit components, includes a carrier (4) by means of which a component (2) is picked-up and brought to and held against the conductors (6) on a printed circuit board (5). The printed circuit board (5) includes at least one cavity (9) underneath the contact conductors (6) in the region where the component (2) is to be held, such as to render the conductors resilient. Pressure pads (7) are placed in the cavity (9) between the bottom of the cavity and the contact conductors (6) such as to regulate the resilience of the conductors (6).

Un ensemble d'essai permet d'essayer des composants électroniques, de préférence des composants de circuits intégrés à montage en surface. Il comprend un dispositif porteur (4) grâce auquel un composant (2) est saisi puis amené vers et maintenu contre des conducteurs (6) disposés sur une carte de circuit imprimé (5). Cette dernière comprend au moins une cavité (9) disposée sous les conducteurs de contact (6), dans la région où le composant (2) doit être maintenu, de sorte que ces conducteurs agissent comme des ressorts. Des tampons presseurs (7) sont situés dans la cavité (9), entre le bas de celle-ci et les conducteurs de contact (6), de sorte que l'effet ressort des conducteurs (6), puisse être modulé.

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