H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/00 (2006.01)
Patent
CA 2554645
The invention relates to a device for thermally treating substrates, wherein the substrates are maintained in contact with or are narrowly distanced from a heating plate which is heated via a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate. The heating plate is surrounded at least on the plane thereof by a frame which is distanced therefrom and gas is guided in a controlled manner through a gap between the frame and at least one edge of the heating plate.
La présente invention concerne un procédé et un dispositif de traitement thermique de substrats, les substrats étant maintenus en contact avec ou à une distance limitée d'une plaque chauffante qui est chauffée par une pluralité d'éléments chauffants qui peuvent être commandés séparément et sont disposés sur le côté de la plaque chauffante, opposé au substrat, la plaque chauffante étant entourée au moins dans son plan par un cadre espacée de celle-ci, et du gaz étant guidé d'une manière contrôlée à travers un espace formé entre le cadre et au moins une arête de la plaque chauffante.
Berger Lothar
Krauss Christian
Saule Werner
Weihing Robert
Hamatech Ape Gmbh & Co. Kg
Robic
Steag Hamatech Ag
LandOfFree
Method and device for thermally treating substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and device for thermally treating substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for thermally treating substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1679805