Method and electrode for defining and replicating structures...

Details Method and electrode for defining and replicating structures... Method and electrode for defining and replicating structures...

C - Chemistry, Metallurgy

25

D

C25D 5/02 (2006.01) B81C 1/00 (2006.01) C25D 7/12 (2006.01) C25F 3/02 (2006.01) C25F 3/14 (2006.01) H05K 3/07 (2006.01) H05K 3/20 (2006.01)

Patent

CA 2462098

The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode (8), is replicated on an electrically conductive material, a substrate (9). The master electrode (8) is put in close contact with the substrate (9) and the etching/plating pattern is directly transferred onto the substrate (9) b y using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells (12, 14), that are formed in closed or open cavities between the master electrode (8) and the substrate (9).

La présente invention concerne un procédé électrochimique de duplication d'un motif, et une construction d'une électrode conductrice pour la production d'applications impliquant des microstructures et des nanostructures. On effectue la reproduction d'un motif de gravure ou de métallisation, défini par une électrode conductrice, une électrode de référence (8), sur un matériau conducteur, un substrat (9). On met l'électrode de référence (8) en contact intime avec le substrat (9) et on effectue le transfert du motif de gravure/métallisation sur le substrat (9) par la mise en oeuvre d'un processus de gravure/métallisation. On effectue le processus de contact de gravure/métallisation dans des cellules de gravure/métallisation locales (12, 14), qui sont formées dans des cavités fermées ou ouvertes entre l'électrode de référence (8) et le substrat (9).

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