Method and equipment to solder printed-circuit assemblies

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/22, 356/8, 3

H05K 3/34 (2006.01) B23K 1/08 (2006.01)

Patent

CA 1265625

ABSTRACT To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering save (21).

557452

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method and equipment to solder printed-circuit assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and equipment to solder printed-circuit assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and equipment to solder printed-circuit assemblies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1297518

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.