Method and means for relieving stresses in die assemblies

Details Method and means for relieving stresses in die assemblies Method and means for relieving stresses in die assemblies

B - Operations, Transporting

21

J

78/39

B21J 13/02 (2006.01) B21K 1/30 (2006.01) B30B 15/02 (2006.01)

Patent

CA 1075505

METHOD AND MEANS FOR REDUCING STRESSES IN DIE ASSEMBLIES Abstract of the Disclosure A method and means for relieving unwanted tensile stresses in a die are disclosed. The method involves steps of determining level of stress in critical regions of the die and then supporting the die in a way to induce counter- stresses that substantially eliminate unwanted tensile stresses therein during a forming operation. A supporting means for reacting to the axial component of loads applied to the die cavity during the forming operation includes a supporting surface which is geometrically related to a contacting surface of the die to effectively reduce or eliminate tensile stresses during the forming operation.

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