H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 1/14 (2006.01) H05K 1/00 (2006.01) H05K 1/11 (2006.01)
Patent
CA 1119314
ABSTRACT OF THE DISCLOSURE A printed circuit board assembly includes at least two layers which is able to accommodate a subsystem such as a memory subsystem designed to have one or more optional fea- tures. The two layers of the printed circuit hoard when etched include the required number of horizontal and vertical paths to be connected to all of the integrated circuit chips to be positioned and interconnected thereon. The required holes for such integrated circuit chips when drilled include first sets of holes for mounting groups of integrated circuit chips required for implementing a first group of features and which are to be interconnected to the other integrated circuit chips of the subsystem mounted on the different sections of the board. Second sets of holes are included on the board so as to have a predetermined relationship with the first sets of holes for mounting alternative groups of integrated circuit chips to be interconnected in a manner to implement other fea- tures. Thereafter, the circuit board is populated with only those integrated circuit chips required for construction of a memory subsystem with one or more selected features. -1-
313269
Johnson Robert B.
Nibby Chester M. Jr.
Honeywell Information Systems Inc.
Smart & Biggar
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