Method and product relating to electrical contact devices

H - Electricity – 01 – H

Patent

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Details

CPC

339/115, 26/122,

IPC codes

H01H 11/04 (2006.01) B26D 7/12 (2006.01) B26F 1/38 (2006.01) H01R 43/00 (2006.01) H01R 43/16 (2006.01)

Type

Patent

Patent number

CA 1037535

Description

Abstract of the Disclosure A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device blank prior to the coining, trimming, slotting and various other forming operations which transform the blank into a finished contact device. The apparatus features a sequential arrangement of gripping devices which manipulate the gold ribbon for processing as stated above, a welding apparatus for combining the gold ribbon segment with the contact blank, a cutting device for cutting the gold ribbon and apparatus for forming the finished electrical contact device. The product features a formed contact device including a contact area with a minimum amount of inlaid or coined gold for effecting desirable contact characteristics.

Application Number

200646

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