B - Operations – Transporting – 26 – D
Patent
B - Operations, Transporting
26
D
B26D 7/18 (2006.01) B24B 55/03 (2006.01) B24B 55/12 (2006.01) B26D 1/46 (2006.01) B26D 1/547 (2006.01) H01L 21/67 (2006.01)
Patent
CA 2643553
The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 µS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid. The system comprises a slicing device provided with a cutting wire, said cutting wire being equipped on its surface with abrasive particles, said slicing device comprising a dispensing unit for delivering a cooling and lubricating fluid to a kerf area where said cutting wire contacts and cuts said body; wherein said fluid promotes removal of powdered substrate material from said kerf area resulting in spent cooling and lubricating fluid; a draining unit for removing said spent fluid from said slicing device; and a fluid reclamation device for treating said spent fluid, said reclamation device comprising a first filtering unit for separating and recovering said powdered substrate material from said spent fluid and providing a reusable fluid.
La présente invention concerne un procédé et un système de fabrication de tranches à partir d'un corps (10) d'un matériau substrat, en particulier pour une utilisation dans la fabrication de dispositifs semi-conducteurs. Le procédé comprend la fourniture d'un dispositif de tranchage à l'aide d'un fil de coupe (16) équipé sur sa surface de particules abrasives (22) ; la fourniture d'un fluide de refroidissement et de lubrification aqueux, ledit fluide présentant une résistance ionique correspondant à une conductivité électrique inférieure ou égale à environ 30 µS/cm ; la découpe dudit corps à l'aide dudit fil de coupe en tranches tout en distribuant ledit fluide de refroidissement et de lubrification dans une zone d'entaille (14) dans laquelle ledit fil de coupe entre en contact avec ledit corps et coupe celui-ci, ledit fluide de refroidissement et de lubrification favorisant le retrait de matériau substrat en poudre de ladite zone d'entaille résultant en un fluide usagé ; et le retrait dudit fluide usagé dudit dispositif de coupe et la récupération dudit matériau substrat en poudre dudit fluide usagé.
Berndt Rolf
Dalitz Lothar
Marks & Clerk
Pall Corporation
LandOfFree
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