Method and system for removing contaminants

Details Method and system for removing contaminants Method and system for removing contaminants

C - Chemistry, Metallurgy

23

G

C23G 1/14 (2006.01) B08B 3/08 (2006.01) B23K 1/018 (2006.01) B23K 1/20 (2006.01) H01R 43/02 (2006.01) H05K 3/26 (2006.01)

Patent

CA 2096546

23 METHOD AND SYSTEM FOR REMOVING CONTAMINANTS ABSTRACT A method for removing contaminants from a solid substrate comprising, in a preferred embodiment: (a) providing an initial reaction bath (10) comprising: (1) an alkaline compound in sufficient amount to provide a pH of 10.5 to 14.0 in the final reaction bath; (2) a chosen wetting agent which is stable in the presence of the alkaline compound and hydrogen peroxide; and (3) deionized water, (b) metering hydrogen peroxide (from container 14) into the initial and final reaction baths at a rate of about 0.004 milligrams of hydrogen peroxide per minute per gallon of reaction bath fluid or higher; (c) sparging (by means 20) the initial and final reaction baths with air or oxygen at a rate of about 0.001 to 1 standard cubic feet per minute; and (d) exposing the substrate having contaminants to the final reaction bath containing metered hydrogen peroxide and sparging air or oxygen. The hydrogen peroxide in the final reaction bath is maintained at an effective level for an extended period of time to remove said contaminants from the substrate in a uniform and controlled manner. Aternatively, other oxidants besides hydrogen peroxide may be used. A system for accomplishing this method is also disclosed.

Affiliated with

Also associated with

Rating

Method and system for removing contaminants does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for removing contaminants, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for removing contaminants will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1773629