Method for accelerated bondline curing

C - Chemistry – Metallurgy – 09 – J

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C09J 5/06 (2006.01) B29C 65/34 (2006.01) H01C 17/065 (2006.01) H05B 3/34 (2006.01)

Patent

CA 2489687

A method is provided for accelerating the curing of an adhesive at a bondline while bonding structures using a fabric heater. The method comprises applying an electrically conductive fabric heater between structures to be bonded to which a layer of adhesives is applied to the bonding surfaces of the structures. Once the adhesive layers and fabric heater are applied to the bondline, pressure is applied and the heater is energized to produce heat uniformly throughout the bondline at the curing temperature of the adhesive so that the adhesive is evenly or symmetrically cured. After curing the adhesive, the heater remains sandwiched at the bondline to act as a reinforcing fabric.

L'invention concerne un procédé permettant d'accélérer le durcissement d'un adhésif au niveau d'une ligne de collage lors du collage de structures à l'aide d'un élément chauffant textile. Le procédé consiste à appliquer un élément chauffant textile électro-conducteur entre des structures à coller sur les surfaces à coller desquelles est appliquée une couche d'adhésif. Lorsque les couches d'adhésif et l'élément chauffant textile sont appliqués sur la ligne de collage, on applique une pression et l'élément chauffant est activé pour produire de la chaleur uniformément sur toute la ligne de collage, à la température de durcissement de l'adhésif, de sorte que l'adhésif est durci régulièrement ou symétriquement. Après durcissement de l'adhésif, l'élément chauffant reste pris en sandwich au niveau de la ligne de collage pour jouer le rôle d'une toile de renforcement.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method for accelerated bondline curing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for accelerated bondline curing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for accelerated bondline curing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1582822

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.