H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H01L 21/48 (2006.01) H05K 3/06 (2006.01) H05K 3/38 (2006.01) H05K 3/14 (2006.01) H05K 3/16 (2006.01)
Patent
CA 2249421
There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.
L'invention porte sur une méthode d'adhésion d'une métallisation sur un substrat. La méthode comprend les étapes suivantes : 1) utiliser un substrat présentant une première surface; 2) appliquer un revêtement sur la première surface de sorte que le revêtement comprenne une seconde surface liée à la première surface, et une troisième surface se conformant généralement à la seconde surface; 3) graver vers l'extérieur le matériel de la troisième surface de façon à rendre la surface rugueuse et à y former des piqûres; et 4) fixer la métallisation aux piqûres de la troisième surface par placage, par pulvérisation ou par un autre procédé semblable.
Baker Jay Deavis
Glovatshy Andrew Zachary
Raghava Ram Singh
Todd Michael George
Ford Motor Company Of Canada Limited
Ford Motor Of Canada Limited
Sim & Mcburney
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