Method for applying a moistureproof coating to printed...

H - Electricity – 05 – K

Patent

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H05K 3/28 (2006.01) B05C 5/00 (2006.01) B05D 1/02 (2006.01) B05D 1/32 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1328783

ABSTRACT A mask-free method is disclosed for applying a moisture-proof insulative coating to selected areas of a printed circuit board without applying the coating to regions that are to remain uncoated. This method includes the step of supplying the insulative liquid coating to a flat-pattern nozzle means at a pressure to produce a liquid film emission in a flat triangular shaped pattern with a lower horizontal base edge, an upper apex, and substantially free of atomized particles of coating. The nozzle means and a circuit board are positioned at a specific distance relative one another to place the board in the path of the flat triangular shape liquid film pattern. Relative movement between the nozzle means and circuit board is effected in a generally transverse direction to the plane of the flat pattern and the liquid coating supply is controlled during the relative movement in order to supply liquid to the nozzle means when the flat pattern is directed toward the selected area to be coated and to interrupt the supply of liquid to the nozzle means when the flat pattern is directed toward regions to be left uncoated.

600965

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