Method for applying a phosphate covering and use of metal...

C - Chemistry – Metallurgy – 23 – C

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C23C 22/18 (2006.01) C23C 22/73 (2006.01) C23C 22/78 (2006.01) C23C 22/83 (2006.01)

Patent

CA 2373145

The invention relates to a method for applying a phosphate coating to metal surfaces by wetting with an aqueous, acidic phosphating solution, whereupon said phospating solution is dried, mainly without re-rinsing . The phosphate solution contains 26 -60 g/l zinc ions, 0.5 -40 g/l manganese ions and 50 -300 g/l phosphate ions, calculated as P2O5. The invention further relates to a method for applying phosphate coatings to metal surfaces by wetting with an aqueous, acidic phosphating solution, whereupon said phosphating solution is dried, mainly without re-rinsing, characterized in that the phosphating solution contains 10 -60 g/l zinc ions, 0.5 -40 g/l manganese ions, 50 - 300 g/l phosphate ions, calculated as P2O5, and 0.5 - 120 g/l peroxide ions, calculated as H2O2,and/or 0.5 - 50 g/l polymers, copolymers or/and cross polymers.

L'invention concerne un procédé de phosphatation de surfaces métalliques par mouillage à l'aide d'une solution de phosphatation aqueuse et acide puis par séchage de cette solution de phosphatation, le plus souvent sans rinçage ultérieur. Selon ce procédé, la solution de phosphatation contient 26 à 60 g/l ions de zinc ; 0,5 à 40 g/l d'ions de manganèse et 50 à 300 g/l d'ions de phosphate, calculé comme P¿2?O¿5?. L'invention concerne également un procédé de phosphatation de surfaces métalliques par mouillage par une solution de phosphatation aqueuse et acide puis par séchage de cette solution de phosphatation, le plus souvent sans rinçage ultérieur, ce procédé étant caractérisé en ce que la solution de phosphatation contient 10 à 60 g/l d'ions de zinc, 0,5 à 40 g/l d'ions de manganèse, 50 à 300 g/l d'ions de phosphate, calculé comme P¿2?O¿5?, et 0,5 à 120 g/l d'ions de péroxyde d'hydrogène, calculé comme H¿2?O¿2?, ou/et 0,5 à 50 g/l de polymères, de copolymères ou/et de polymères réticulés.

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