G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 6/42 (2006.01)
Patent
CA 2101663
ABSTRACT OF THE DISCLOSURE In one embodiment, the present invention includes a method of increasing the attachment bond strength between a first and second object comprising respective first and second materials. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (Fig. 4). An attachment surface of the first material is configured to be nonplanar (Fig. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (Fig. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature wherein at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least of the first and second materials as compared with the change in size of the other of the first and second materials. In a second and third embodiment, the present invention pertains to a method of sealing an end of a sleeve having an axial channel and a fiber extending through the axial channel and outward from the sleeve end.
Bonham Harry B. Jr.
Bontz Robert L.
Ma David L.
Moore Andrew J.
Alcatel Networks Systems Inc.
Robic
LandOfFree
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