Method for bonding a wire conductor laid on a substrate

Details Method for bonding a wire conductor laid on a substrate Method for bonding a wire conductor laid on a substrate

H - Electricity

01

L

H01L 21/98 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2639645

Method for bonding a wire conductor arranged on a preferably card-like substrate 1 during the manufacture of a transponder unit T having a wire coil 3 and a chip module 5, comprising a first phase, wherein the coil 3 is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module 5 are bonded, whereas in the first phase at least one of the end portions 4 of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop 9 being formed, and that the loop 9 thus formed is gripped in a second phase and a section of the loop 9 is then bonded with a bonding area 6 of the chip module 5 and attached to it in an electrically conductive manner.

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