Method for bonding integrated circuit chips

Details Method for bonding integrated circuit chips Method for bonding integrated circuit chips

H - Electricity

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H01L 21/58 (2006.01) H01L 21/60 (2006.01) H01L 23/495 (2006.01) H05K 3/30 (2006.01) H05K 13/04 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1290676

ABSTRACT METHOD FOR BONDING INTERGRATED CIRCUIT CHIPS A method for rapidly bonding an integrated circuit chip to a mating surface of a high surface energy substrate using an adhesive pad made from A substantially amorphous, solvent-free thermoplastic polymer.

562391

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