B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 65/34 (2006.01) B29C 65/36 (2006.01) H05B 3/34 (2006.01)
Patent
CA 2547508
A method for bonding thermoplastic substrates is provided. A thin, porous, resistive heater is provided between layers of thermoplastic substrates to be bonded in the absence of an adhesive. The fabric heater is in intimate contact with the substrates at the joint by application of pressure. When the heater is energized, the thermoplastic material at the joint is melted or softened, and becomes uniformly distributed in the weld. After cooling, the fabric heater remains within the weld area and provides increased reinforcement to the weld bond.
L'invention concerne un procédé de liaison de substrats thermoplastiques. Selon l'invention, un élément chauffant résistif mince, poreux est placé entre les couches de substrats thermoplastiques à lier sans adhésif. L'élément chauffant sous forme de toile est mis en contact intime avec les substrats dans la zone de leur jonction par application d'une pression. Lorsque l'élément chauffant reçoit de l'énergie, la matière thermoplastique se trouvant au niveau de la jonction fond ou se ramollit et se répartit uniformément dans la zone de soudure. Après refroidissement, l'élément chauffant sous forme de toile reste à l'intérieur de la zone de la soudure et augmente la résistance de la soudure.
Miller Andrew J.
Smith Faye C.
Wilkinson Andrew S.
Ridout & Maybee Llp
Thermion Systems International
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